Qianmu provide our customers with a variety of customized product lines, including VCSEL, edge-emitting laser and DFB laser devices and corresponding packaging forms.Accepting customization of customer to obtain greater optical power and meet customer requirements for array patterns.

SMD Package

According to a specific application scenario, the chip is encapsulated in the form of patch to meet the requirements of
different divergence angles.This packaging form reduces the manufacturing process and cost of the supports, not only
reduces the volume, but also uses the base plate to directly dissipate heat and reduce thermal resistance.
Product NO. Product Name Type Mode Structure mW * * *
3000-0001 3532 package with diffuser AIN substrate 35mm×32mm
3000-0003 3535 package with diffuser AIN substrate 35mm×35mm

Showing 2 products total