Qianmu provide our customers with a variety of customized product lines, including VCSEL, edge-emitting laser and DFB laser devices and corresponding packaging forms.Accepting customization of customer to obtain greater optical power and meet customer requirements for array patterns.
TO-can Package
According to a specific application scenario, the chip is encapsulated using to-can. When space allows,
the radiator and active cooling system can be conveniently added, suitable for medium and high power chip.
