Qianmu provide our customers with a variety of customized product lines, including VCSEL, edge-emitting laser and DFB laser devices and corresponding packaging forms.Accepting customization of customer to obtain greater optical power and meet customer requirements for array patterns.

TO-can Package

According to a specific application scenario, the chip is encapsulated using to-can. When space allows, 
the radiator and active cooling system can be conveniently added, suitable for medium and high power chip.
Product NO. Product Name Type Mode Structure mW * * *
3000-0002 To can package-2.5W-Rev 1 2500 Cu substrate 5.6mm

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